CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability.
Qualcomm Multiple Chipsets Use-After-Free Vulnerability. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
- CISA KEV-listed (remediation due 2023-12-26)
- EPSS 0.4% (63.6% percentile)